Autodesk University
Roundtable    SIM21009-R
Electronics Cooling Simulation Roundtable
Autodesk University
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Description

We invite customers who have a need to simulate thermal management of electronics to attend this roundtable. We plan on discussing and discovering common electrical computer-aided design (ECAD) and mechanical computer-aided design (MCAD) workflows, going from ideation, conceptual layout, and final design. Thermal management fits in this design process throughout and we will present some mockups on how we see the next generation of simulation fitting into the design process. We hope to gain insight from the roundtable regarding how participants currently manage the ECAD data and use it along with MCAD data to perform thermal simulation, where their struggles are, and what could be done to make everything easier. This session features CFD, Forge, and Fusion 360.

Key Learnings

  • Understand common ECAD workflows
  • See the direction Autodesk wants to take thermal simulation
  • See how the cloud can change thermal management workflows
  • Gain an open line of communication with simulation product management

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