{"id":568,"date":"2017-05-09T08:00:42","date_gmt":"2017-05-09T15:00:42","guid":{"rendered":"http:\/\/www.autodesk.com\/products\/eagle\/blog\/?p=568"},"modified":"2023-09-26T10:20:51","modified_gmt":"2023-09-26T17:20:51","slug":"eagle-pro-webinar-bga-via-flight-patterns","status":"publish","type":"post","link":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/eagle-pro-webinar-bga-via-flight-patterns\/","title":{"rendered":"EAGLE Pro Webinar – BGA & Via Flight Patterns"},"content":{"rendered":"

EAGLE Pro Webinar – BGA & Via Flight Patterns<\/a><\/h1>\n

If you\u2019re planning to jump into the latest technology\u00a0in electronic designs, like touch screens, 4G communications, or avionics, then you\u2019ll most likely be digging into High-Density Interconnect PCBs (HDIs). And if you are, then prepare to see the space on your board layout shrinking before your very eyes! The first time you dive into an HDI design, you might wonder how you\u2019ll ever fit all of those components and traces together in that tiny area. It just doesn\u2019t seem possible. With your usual PCB design bag of tricks, like 50\/25 vias and 10 mil tracks, it won\u2019t be possible. You need to upgrade your bag! Join us for a free webinar where we\u2019ll show you the tricks of the trade for HDI design with BGA routing and specialized vias.<\/span><\/p>\n

Shrinking Board Sizes<\/h2>\n

There\u2019s nothing simple about designing an HDI PCB, and you\u2019ll start to work with a ton of interesting objects, like lasered microvias, traces that you can barely see, and blind and buried holes that snake their way through the inner layers of your PCB. But if you want to be able to design boards with large pin-count chips for use in mobile devices and other super compact technologies, then you need to learn about HDI design techniques.<\/span><\/p>\n

Working on my first HDI design was a heck of a learning experience. I still remember looking, white-knuckled, at my first 500\u00b5m pitch BGA and having no idea where to start. How was I going to fan out all of those nets using my 10 mil tracks with only .5mm of space with which to\u00a0work?! I was clearly way out of my zone of expertise here and needed some help.<\/span><\/p>\n

So I started doing some research on what new tools and knowledge I needed to incorporate into my skillset. Ever heard of a \u201cDogbone\u201d in PCB design? Yeah, neither had I. It turns out there was an entire world of vias that defied the realities of simply connecting the top to bottom layers of a board. There were blind vias, which could connect the outer layer of a PCB with an inner layer. And those buried vias, which could connect two inner layers together. And did you know that you can place vias within the pad of a component? That\u2019s microvias at work.<\/span><\/p>\n

My perspective had suddenly opened wide to an entirely new set of tools that could accommodate the unique needs of a high-density board layout. With these new tools in hand, I spent the next several hours trying to work my way through fanning out my BGA. And along the way, I had a flurry of questions going on in my mind, like:<\/span><\/p>\n