{"id":17943,"date":"2022-12-07T08:13:35","date_gmt":"2022-12-07T16:13:35","guid":{"rendered":"http:\/\/www.autodesk.com\/products\/eagle\/blog\/?p=1556"},"modified":"2023-06-12T10:29:39","modified_gmt":"2023-06-12T17:29:39","slug":"top-10-tips-high-speed-pcb-design","status":"publish","type":"post","link":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/top-10-tips-high-speed-pcb-design\/","title":{"rendered":"Top 10 Tips for High-Speed PCB Design (2022 Update)"},"content":{"rendered":"\n<p><em>Learn how to make your first high-speed PCB design a success by minimizing crosstalk, EMI, and more.<\/em><\/p>\n\n\n\n<figure class=\"wp-block-image size-large\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"682\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/dm-consumer-products-photo-iterate-uk-8964-1-1024x682.jpg\" alt=\"high-speed-pcb-design-iterate\" class=\"wp-image-40331\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/dm-consumer-products-photo-iterate-uk-8964-1-1024x682.jpg 1024w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/dm-consumer-products-photo-iterate-uk-8964-1-300x200.jpg 300w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/dm-consumer-products-photo-iterate-uk-8964-1-768x512.jpg 768w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/dm-consumer-products-photo-iterate-uk-8964-1.jpg 1280w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">It wasn\u2019t that long ago when the word \u201chigh speed\u201d didn\u2019t exist in the vocabulary of PCB designers. But these days, it seems to be just the opposite. Back then, the concern was all about putting the puzzle pieces together and strategizing your way through a physical board layout. But with <a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/high-speed-pcb-design-part-1\/\">high-speed PCB design<\/a>? Now there are a bunch of invisible forces to worry about<\/span>. T<span style=\"font-weight: 400;\">hings like electromagnetic interference (EMI), crosstalk, signal reflection, and the list goes on. Here are some practical tips to make your first high-speed design process a success. <\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"more-data-more-emi\">More data, more EMI<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">In 2005, 3 Gbps was considered the typical high-speed data rate, but today engineers<\/span> <span style=\"font-weight: 400;\">deal with 10 Gbps and even 25. <\/span>Not only are they dealing with that rate, but there is a constant push to get faster<span style=\"font-weight: 400;\"> clock rates<\/span>.<span style=\"font-weight: 400;\"> <\/span>D<span style=\"font-weight: 400;\">evices <\/span>are getting<span style=\"font-weight: 400;\"> smaller than ever to meet growing consumer demand. If you\u2019re designing today, you most likely already incorporate some aspect of high-speed design<\/span>. There&#8217;s <span style=\"font-weight: 400;\">DDR, PCI Express, USB, SATA, etc.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">At the heart of high speed, PCB design is an issue of interference. The faster your data rates are, the more issues you have trying with to protect the integrity of your signals. Most of these problems stem from electromagnetic radiation. This radiation is relatively harmless in small amounts when it makes contact with a circuit. But when it starts to interfere with the operation of your electronic device as a whole, then radiation becomes interference.<\/span> <span style=\"font-weight: 400;\">And Electromagnetic Interference (EMI) becomes a whole new world of issues! If you\u2019ve ever heard or encountered issues related to noise, then you know exactly what we\u2019re talking about.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full wp-image-1558\"><img loading=\"lazy\" decoding=\"async\" width=\"601\" height=\"439\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/emwavec.png\" alt=\"\" class=\"wp-image-39582\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/emwavec.png 601w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/emwavec-300x219.png 300w\" sizes=\"auto, (max-width: 601px) 100vw, 601px\" \/><figcaption class=\"wp-element-caption\"><em>Any current is going to produce a magnetic field, and that\u2019s the start of electromagnetic radiation. (<a href=\"http:\/\/hyperphysics.phy-astr.gsu.edu\/hbase\/Waves\/emwavecon.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">So you might be wondering, how in the world do you ever know if you&#8217;re working on a high-speed PCB design project without discovering it through EMI issues? There are several schools of thought here, and we\u2019ll break down the top 3:<\/span><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><b>Frequency<\/b><span style=\"font-weight: 400;\">. The first thought is that high-speed design is categorized based on the frequency of a PCB and its ability to affect circuit performance. For some, this means anything above 50 MHz. Others categorize it into several buckets for low speed (&lt;25 MHZ), moderate speed (25-100 MHz), high speed (100-1000 MHz), and anything above that is an ultra-high speed, reserved for RF designers. <\/span><\/li>\n\n\n\n<li><b>Traces<\/b><span style=\"font-weight: 400;\">. There\u2019s also the school of thought that you can use the physical dimensions of your trace to determine if you\u2019re working with a high-speed device. This guideline states that once a trace is more than \u2153 the rise time of your device\u2019s switching speed, then you\u2019ve got high speed. <\/span><\/li>\n\n\n\n<li><b>Separation<\/b><span style=\"font-weight: 400;\">. The last perspective takes a general approach, looking at your circuit design as a whole and asking the following question &#8211; does your system physically work together uniformly? Or do you have a bunch of subcircuits that are all organized into one larger circuit, with everything working together separately? The latter puts you into the realm of high-speed design. <\/span><\/li>\n<\/ol>\n\n\n\n<p><span style=\"font-weight: 400;\">Got your upcoming project classified as high speed? Great. That\u2019s all the background noise you need to worry about. Let\u2019s dive into our <a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/10-high-speed-pcb-design-rules\/\">top 10 tips<\/a> for a successful design process.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"1-always-start-your-highspeed-pcb-design-process-with-a-plan\">1. Always start your high-speed PCB design process with a plan<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">We\u2019re starting with the most obvious tip, but for a good reason. Without a plan and a strategy for your high-speed <a href=\"https:\/\/www.autodesk.com\/solutions\/pcb-design-software\">PCB design<\/a> project, you&#8217;ll likely encounter setbacks, respins, and unexpected issues. So before ever laying down a symbol or connecting a net, you need a checklist in hand for what lies ahead. Here are <\/span>a few questions to ask<span style=\"font-weight: 400;\"> yourself:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><b>System organization<\/b><span style=\"font-weight: 400;\"> &#8211; Do I have a visual diagram that will help me to <\/span>see <span style=\"font-weight: 400;\">how all of my sub-circuits interconnect and a well-established return current?<\/span><\/li>\n\n\n\n<li><b>Signal speed<\/b><span style=\"font-weight: 400;\"> &#8211; Do I know the highest frequency and fastest rise time of each of my signals?<\/span><\/li>\n\n\n\n<li><b>Power supply<\/b><span style=\"font-weight: 400;\"> &#8211; Have I documented every one of my voltage and power requirements for all of my IC<\/span>? W<span style=\"font-weight: 400;\">ill I need to split any power planes? <\/span><\/li>\n\n\n\n<li><b>Sensitive signals<\/b><span style=\"font-weight: 400;\"> &#8211; Do I have a plan to meet my requirements for differential signals, controlled impedance, and trace length or propagation?<\/span><\/li>\n<\/ul>\n\n\n\n<p><span style=\"font-weight: 400;\">These are not the only questions to keep in mind during the planning stage, but they\u2019ll get you started. You\u2019ll also likely need to work with your manufacturer to understand their minimum tolerance requirements. And you\u2019ll need to consider developing a strategy to reduce the level of noise on your high-speed signals with a variety of routing methods, including <a href=\"https:\/\/www.eeweb.com\/traces-vs-microstrips-vs-striplines\/\" target=\"_blank\" rel=\"noreferrer noopener\">microstrip or stripline traces<\/a>.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image size-full is-resized\"><img loading=\"lazy\" decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/microstrip-eeweb-17-202518-2.jpg\" alt=\"\" class=\"wp-image-39632\" width=\"711\" height=\"222\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/microstrip-eeweb-17-202518-2.jpg 734w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/microstrip-eeweb-17-202518-2-300x94.jpg 300w\" sizes=\"auto, (max-width: 711px) 100vw, 711px\" \/><figcaption class=\"wp-element-caption\"><em>Traces(<a href=\"https:\/\/www.eeweb.com\/traces-vs-microstrips-vs-striplines\/\">Image source<\/a>) <\/em><\/figcaption><\/figure>\n\n\n<h2 class=\"wp-block-heading\" id=\"2-document-every-detail-of-your-board-stackup-for-manufacturing\">2. Document every detail of your board stack-up for manufacturing<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">To build off of the planning stage in Tip 1, it\u2019s now time to define and document your layer stack-up requirements thoroughly. This is a perfect time to get together with your manufacturer to determine what materials of your board and what specific constraints you need to input into your design rules. As far as materials go, you\u2019ll likely be working with one of these:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><b>FR-4<\/b><span style=\"font-weight: 400;\">. This is a great material when you&#8217;re working with clock speeds of &lt; 5Gbps and is classified as a low-speed material. FR-4 has a decent ability to control impedance and is also known for its low cost. <\/span><\/li>\n\n\n\n<li><b>Nelco, SI, or Megtron<\/b><span style=\"font-weight: 400;\">. In the realm of high-speed PCB design, you\u2019ll likely be working with these materials. Each is suited for 5-25 Gbps clock speeds.<\/span><\/li>\n\n\n\n<li>If your first high-speed design is pushing 56Gbps, then you\u2019ll likely end up using a Rogers laminate. This is a high-frequency, high-temperature material known for good impedance consistency, but it\u2019s also expensive to produce.<\/li>\n<\/ul>\n\n\n<h4 class=\"wp-block-heading\" id=\"layer-stackup-strategies\">Layer stack-up strategies<\/h4>\n\n\n<p><span style=\"font-weight: 400;\">Once you know the material, you\u2019<\/span>re just about ready for manufacturing. <span style=\"font-weight: 400;\">Now it\u2019s time to keep some other layer stack-up strategies in mind.<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">First, you\u2019ll always need to have a signal layer placed adjacent to a plane layer to provide your signals with an efficient return path. <\/span><\/li>\n\n\n\n<li>Also, <span style=\"font-weight: 400;\">consider routing all of your high-speed signals on the inner layers of your board between planes<\/span>. This <span style=\"font-weight: 400;\">will provide shielding against any external emitted radiation.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Lastly, I suggest using multiple ground planes in your layer stack-up. This will help to lower your reference impedance and reduce common-mode radiation from affecting your circuit. <\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"3-floor-planning-nbsporganize-your-board-into-logical-sections\">3. Floor planning \u2014 organize your board into logical sections<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">Along the lines of planning out your high-speed design requirements and your layer stack up, you also need to consider how <\/span>you&#8217;re going to organize your board<span style=\"font-weight: 400;\">. Remember above when we talked about how high-speed design can be classified based on a collection of sub-circuits? You\u2019ll need to decide where all of these sub-circuits are placed within the larger design.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">This is particularly the case for digital and analog sections, which need to be carefully isolated to reduce any potential interference. When planning out the physical organization of your layout, consider something like the image below. This engineer has clearly kept digital away from analog, and the Power section isolated from both digital and analog.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"4-know-how-to-use-your-power-and-ground-planes\">4. Know how to use your power and ground planes<\/h2>\n\n\n<p>Your <span style=\"font-weight: 400;\">layer stack-up is fully defined<\/span>!<span style=\"font-weight: 400;\"> <\/span>Now, it&#8217;s<span style=\"font-weight: 400;\"> time to get into the nitty-gritty details that you\u2019ll need to consider when designing. The first is your ground plane, which needs to be complete. By this, we mean not splitting your ground plane with any routed signals. If you create a split in this plane, signals will have to go around the void<\/span>.<span style=\"font-weight: 400;\"> <\/span>This<span style=\"font-weight: 400;\"> can lead to some nasty EMI and signal timing issues. If you do need to split a ground plane, then be sure to add a 0 Ohm resistor alongside the signal trace.<\/span> This allows<span style=\"font-weight: 400;\"> your return signal <\/span>to have a <span style=\"font-weight: 400;\">bridge to make its return path easier.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1562\"><img loading=\"lazy\" decoding=\"async\" width=\"1024\" height=\"279\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/split-ground-planes-www.nwengineeringllc.-1024x279.jpg\" alt=\"\" class=\"wp-image-39708\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/split-ground-planes-www.nwengineeringllc.-1024x279.jpg 1024w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/split-ground-planes-www.nwengineeringllc.-300x82.jpg 300w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/split-ground-planes-www.nwengineeringllc.-768x209.jpg 768w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/split-ground-planes-www.nwengineeringllc.-1536x419.jpg 1536w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/split-ground-planes-www.nwengineeringllc..jpg 1824w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><figcaption class=\"wp-element-caption\"><em>Split Ground Plane(<a href=\"https:\/\/www.nwengineeringllc.com\/article\/should-you-split-ground-planes-in-mixed-signal-pcb-design.php\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n<h2 class=\"wp-block-heading\" id=\"5-keep-the-size-of-your-land-patterns-at-a-minimum\">5. Keep the size of your land patterns at a minimum<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">Any PCB design you\u2019ve worked on in the past has probably had larger pads than was necessary. This was done for obvious reasons. It makes it easier to fit a soldering iron on the pad, inspections are quicker, and component placement precision becomes less of an issue.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">But with high-speed designs, your board real estate is going to be at a premium<\/span>.<span style=\"font-weight: 400;\"> <\/span>E<span style=\"font-weight: 400;\">very inch of space you can save will count towards making it all fit. In light of this, we recommend maintaining a minimum oversize for all of your pads at 0-5% of the size of the component pins. This is compared with a traditional oversize of around 30% for standard electronic designs.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Why the drop in space? Not only will this help to improve mechanical strength, but it\u2019s also going to reduce your parasitic capacitanc<\/span>e. This really<span style=\"font-weight: 400;\"> comes in handy when dealing with high frequencies. <\/span>M<span style=\"font-weight: 400;\">ost importantly, the less space you give to your pads, the more room you\u2019ll have for differential pairs, vias, and those high pin-count parts like FPGAs or ICs.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"6-route-your-signals-for-maximum-shielding-benefits\">6. Route your signals for maximum shielding benefits<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">The high-frequency signals on your board are going to be emitting a ton of electromagnetic radiation as they travel from source to sink. <\/span>T<span style=\"font-weight: 400;\">he last thing you want to happen is to have two signals interfering with each other or a nearby component. To avoid conflicts on your board and maximize shielding benefits for your signals, consider these guidelines:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Be sure to keep long, parallel signals on your board at a minimum to avoid any signal coupling or crosstalk. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Maintain as much distance as possible between your signal traces, and even consider routing signals on a separate layer if they\u2019re going to be particularly noisy. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">When routing signals on different layers, be sure to route them orthogonally to each other. That is, on one signal layer, your traces will be routed horizontally, and on the other, vertically, 45 degrees, etc.<\/span><\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full wp-image-1563\"><img loading=\"lazy\" decoding=\"async\" width=\"600\" height=\"493\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/Orthogonal-routing.jpg\" alt=\"Orthogonal-layer-routing\" class=\"wp-image-40236\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/Orthogonal-routing.jpg 600w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/Orthogonal-routing-300x247.jpg 300w\" sizes=\"auto, (max-width: 600px) 100vw, 600px\" \/><figcaption class=\"wp-element-caption\"><em>Each layer is being routed <\/em>in <em>a different direction orthogonally to avoid coupling. (<a href=\"http:\/\/www.edn.com\/design\/pc-board\/4425712\/Speed-and-improve-PCB-routing\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n<h2 class=\"wp-block-heading\" id=\"7-provide-an-efficient-path-for-current-return\">7. Provide an efficient path for current return<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">On high-speed designs, each of your signals is going to seek a route from source to sink along the path of least impedance. For system clocks and other high-speed I\/O devices, ensuring this smooth path of travel might require the use of a via. Without these, you might find yourself with currents spreading around splits in your ground plane, and in turn, leading to a loss of <a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/signal-integrity-extension\">signal integrity.<\/a><\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full wp-image-1564\"><img loading=\"lazy\" decoding=\"async\" width=\"435\" height=\"345\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/transition-via-signcon.jpg\" alt=\"Signal--current-transition-vias\" class=\"wp-image-39734\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/transition-via-signcon.jpg 435w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/transition-via-signcon-300x238.jpg 300w\" sizes=\"auto, (max-width: 435px) 100vw, 435px\" \/><figcaption class=\"wp-element-caption\"><em>Transition vias can quickly get your traces from source to sink on <\/em>high-speed<em> layouts. (<a href=\"http:\/\/www.sigcon.com\/Pubs\/news\/6_04.htm\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">If you do find yourself using vias to return your currents to their termination, then make sure you use tightly coupled, impedance-matched differential vias.<\/span> This will<span style=\"font-weight: 400;\"> ensure your signals arrive on time. And when placing your return vias, place them as close as possible to your signal vias to minimize the length your signal has to travel.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"8-use-the-3w-rule-to-minimize-coupling-between-traces\">8. Use the 3W Rule to minimize coupling between traces<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">Having your transmission lines couple can spell bad news for the integrity of your signal in transit. And while there\u2019s always the general rule of keeping traces as far apart as possible to minimize this risk, it gets a bit fuzzy when it comes to the execution.<\/span><\/p>\n\n\n\n<p>If you&#8217;re<span style=\"font-weight: 400;\"> wonder<\/span>ing<span style=\"font-weight: 400;\"> how far you need to keep your traces from each other to minimize coupling, then use the 3W Rule. It states that the separation between traces must be three times the width of a single trace when measured from center to center. You can also increase this separation from three to 10 times to get even greater gains on reducing coupling and crosstalk.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full wp-image-1565\"><img loading=\"lazy\" decoding=\"async\" width=\"877\" height=\"419\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/trace-width-calc-eeweb.jpg\" alt=\"PCB-trace-calculator\" class=\"wp-image-39807\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/trace-width-calc-eeweb.jpg 877w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/trace-width-calc-eeweb-300x143.jpg 300w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/trace-width-calc-eeweb-768x367.jpg 768w\" sizes=\"auto, (max-width: 877px) 100vw, 877px\" \/><figcaption class=\"wp-element-caption\"><em>Always handy to keep a trace-width calculator bookmarked. (<a href=\"https:\/\/www.eeweb.com\/tools\/external-pcb-trace-width\/\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n<h2 class=\"wp-block-heading\" id=\"9-use-the-20h-rule-to-minimize-plane-coupling\">9. Use the 20H Rule to minimize plane coupling<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">In addition to the risk of coupling for individual traces, you also have to worry about the coupling between power and ground planes on your layout. If these two couple, you\u2019ll get RF radiation spilling off the edges of your board, called fringing.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">To prevent this from happening, you\u2019ll want to make any power plane that is adjacent to a ground plane smaller than the ground plane. This will allow any fringing to be absorbed into the ground plane instead of radiating out externally. How much smaller, though? Use the 20\u1427H rule, which says to make your power plan 20 times smaller than the dielectric thickness between your adjacent power and ground planes.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-full wp-image-1566\"><img loading=\"lazy\" decoding=\"async\" width=\"626\" height=\"192\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/GND-edn.jpg\" alt=\"20-H-rule\" class=\"wp-image-39740\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/GND-edn.jpg 626w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/11\/GND-edn-300x92.jpg 300w\" sizes=\"auto, (max-width: 626px) 100vw, 626px\" \/><figcaption class=\"wp-element-caption\"><em>The 20\u1427H rule helps to reduce coupling between power and ground planes. (<a href=\"http:\/\/www.edn.com\/Home\/PrintView?contentItemId=4430372\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n<h2 class=\"wp-block-heading\" id=\"10-finishing-with-general-routing-guidelines\">10. Finishing with general routing guidelines<\/h2>\n\n\n<p>In comes routing t<span style=\"font-weight: 400;\">o finish off our top 10 tips! <\/span>Routing<span style=\"font-weight: 400;\"> really deserves a blog post <\/span>and<span style=\"font-weight: 400;\"> book of its own to address things like RF, microwave, or antenna design. This list isn\u2019t exhaustive, so be sure to seek out the advice of a seasoned engineer for application-specific routing techniques. Here we go:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><b>90-degree no-no<\/b><span style=\"font-weight: 400;\">. The first is always to avoid using 90-degree angle bends in your traces. Right-angled traces can lead to signal reflections. <\/span><\/li>\n\n\n\n<li><b>Differential pairs<\/b><span style=\"font-weight: 400;\">. You\u2019ll only get the benefits of electromagnetic field cancellation when both the signals in your differential pair have the same length and gap. This will likely require some length match tuning in your PCB design software.<\/span><\/li>\n\n\n\n<li><b>Transmission lines<\/b>. Take the time to carefully design your transmission lines with the use of microstrip or stripline traces. Microstrip traces will only provide one reference plane separated by a dielectric. If you need more shielding capabilities, then a stripline will place a trace between multiple ground planes and a dielectric.<\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"highspeed-pcb-design-with-fusion-360\">High-speed PCB design with Fusion 360<\/h2>\n\n\n<p>Now you&#8217;re ready to start <span style=\"font-weight: 400;\">div<\/span>ing<span style=\"font-weight: 400;\"> deeper into the world of high-speed design<\/span>!<span style=\"font-weight: 400;\"> S<\/span>oon enough, you&#8217;ll start<span style=\"font-weight: 400;\"> combating EMI with EMC or electromagnetic compatibility <\/span>with a 1, 2 punch<span style=\"font-weight: 400;\">. T<\/span>here&#8217;s still so much to learn. <span style=\"font-weight: 400;\">So consider these top 10 tips as just <\/span>the basics<span style=\"font-weight: 400;\"> to get you started on your first project<\/span>!<\/p>\n\n\n\n<p>Check out this three-part series to learn more about high-speed PCB design in Fusion 360:<\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/high-speed-pcb-design-part-1\/\">How To Identify a High Speed Design<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/high-speed-pcb-design-part-2\/\" rel=\"nofollow\">What to Consider First<\/a><\/li>\n\n\n\n<li><a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/high-speed-pcb-design-part-3-signal-integrity\/\">Avoiding Signal Integrity Issues<\/a><\/li>\n<\/ol>\n\n\n\n<p><span style=\"font-weight: 400;\">Ready to begin your first high-speed design project? The Autodesk <a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/signal-integrity-extension\" target=\"_blank\" rel=\"noreferrer noopener\">Fusion 360 Signal Integrity Extension<\/a> has all the tools you need and much more. Get started for free today:<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><a href=\"https:\/\/www.autodesk.com\/products\/fusion-360\/signal-integrity-extension\"><img loading=\"lazy\" decoding=\"async\" width=\"766\" height=\"128\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/04\/Download-free-trial.jpg\" alt=\"\" class=\"wp-image-31486\" srcset=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/04\/Download-free-trial.jpg 766w, https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/2022\/04\/Download-free-trial-300x50.jpg 300w\" sizes=\"auto, (max-width: 766px) 100vw, 766px\" \/><\/a><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>Learn how to make your first high-speed PCB design a success by minimizing crosstalk, EMI, and more.<\/p>\n","protected":false},"author":3911,"featured_media":40331,"menu_order":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"categories":[359],"tags":[209,207,206],"coauthors":[],"class_list":["post-17943","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-electronics-engineering","tag-electrical-engineer","tag-electronics","tag-pcb","dhig-theme--light"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - 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I joined the EAGLE team 25 years ago to satisfy my passion for being involved with circuit board designs. I\u2019m the Technical Marketing Engineer for Fusion 360 electronics and part of the Fusion 360 community team. I have published best practices articles, Blogs, hundreds of video tutorials, and hosted several electronic design bootcamps. My passion is anything related to the outdoors, especially outdoor photography and hiking.","url":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/author\/edwin-robledo\/"}]}},"_links":{"self":[{"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/posts\/17943","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/users\/3911"}],"replies":[{"embeddable":true,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/comments?post=17943"}],"version-history":[{"count":0,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/posts\/17943\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/media\/40331"}],"wp:attachment":[{"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/media?parent=17943"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/categories?post=17943"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/tags?post=17943"},{"taxonomy":"author","embeddable":true,"href":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-json\/wp\/v2\/coauthors?post=17943"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}