{"id":1321,"date":"2017-07-17T08:00:11","date_gmt":"2017-07-17T15:00:11","guid":{"rendered":"http:\/\/www.autodesk.com\/products\/eagle\/blog\/?p=1321"},"modified":"2023-09-25T13:00:29","modified_gmt":"2023-09-25T20:00:29","slug":"getting-layer-stack-right-first-time","status":"publish","type":"post","link":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/getting-layer-stack-right-first-time\/","title":{"rendered":"Getting Your Layer Stack Right the First Time"},"content":{"rendered":"<h1 class=\"wp-block-heading\" id=\"getting-your-layer-stack-right-the-first-time-a-guide-for-every-engineer\"><span style=\"font-weight: 400;\">Getting Your Layer Stack Right the First Time: A Guide for Every Engineer<\/span><\/h1>\n\n\n<p><span style=\"font-weight: 400;\">Are you taking enough time to plan your layer stackup? If you\u2019re like most designers, then you\u2019re probably just figuring out how many layers you need and leaving the rest up to your manufacturer. But consider this, an improperly planned layer stackup can lead to nasty issues like excess heat, crosstalk, and impedance mismatching. So if one of these problems might be plaguing your design project, then this is one step in your workflow that is better left in your domain of expertise. Ready for a new perspective on managing your layer stackup? Let\u2019s take a look at how to get your layer stack done right the first time, every time.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"the-layer-stacks-of-yesterday-and-today\">The Layer Stacks of Yesterday and Today<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">Gone are the days of PCBs just being single-layer boards with no vias, clock speeds of around 100 kHz, and basic through-hole components. These days, you\u2019ll find PCBs with as many as 50 layers, with components on both sides of your board, and even some nestled in between layers. And those days of KHz signals speeds are now in the 28+ Gb\/S range. Point being, as the technology in our PCBs advances, so does the importance of planning out a solid layer stackup before you ever begin your design.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large wp-image-1323 size-full\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/article_12_ud3_clip_image004.jpg\" alt=\"complex-layer-stack\"\/><figcaption class=\"wp-element-caption\"><em>Farewell single-layer boards, today\u2019s layer stacks are much more complex.<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">The layer stackup might seem deceptively simple at first glance. After all, isn\u2019t it just describing the basic construction on a PCB with its various layers? While the stuckup might be a simple visual cross-section of your PCB, what it manages to achieve for your design is vital. Did you know that it can:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Help you to minimize radiation and prevent your circuit from being affected by external noise source? <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Help you to reduce crosstalk and impedance issues on your high-speed PCB layouts?<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Help you to balance Signal Integrity (SI) issues with the needs for low cost and efficient manufacturing methods?<\/span><\/li>\n<\/ul>\n\n\n\n<p>And most important of all, did you know that a properly planned layer stack is one of the most valuable tools in your toolbox for enhancing the Electromagnetic Compatibility (EMC) of your design? So before you go off calculating impedances, or matching trace lengths to minimize electromagnetic interference (EMI) on your board, what you need to do is start with a properly planned layer stack.<\/p>\n\n\n\n<p>Without a plan for what materials you intend to use, and in what order they\u2019re arranged, you might find yourself dealing with symptoms like poor electrical performance, increased emissions, and even timing glitches. All of these and more can be solved when you make an effort to get your layer stack done right the first time.<\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"what-kind-of-layer-stack-do-you-need\">What Kind of Layer Stack Do You Need?<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">The answer to that question ultimately depends on the specifics requirements of your design. These days manufactured PCBs are broken down into two general categories: single-layer and multilayer PCBs. But what\u2019s in the details?<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Single-layer PCBs are ideal for the most basic devices and include either one or two copper layers (Top and Bottom) for you to lay down components and traces on. While these boards won\u2019t be a focus for this blog, it\u2019s good to know that they still exist, and are usable until you hit a frequency range of 25MHz.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">More layers afford you a lot more than more space to route. Once you<\/span><span style=\"font-weight: 400;\">r frequency needs have climbed, you\u2019ll start to live in the world of multilayer PCBs. These types of boards take advantage of multiple cores, which consist of a symmetrically balanced structure of alternating copper layers and insulating prepreg material. Check out the image below to get a visual on how this all comes together in an 8-layer PCB.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large wp-image-1325 size-full\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/58257d151b777-1.jpg\" alt=\"8-layer-stackup\"\/><figcaption class=\"wp-element-caption\"><em>An 8-layer stack with plenty of room for high speed signals. (<a href=\"https:\/\/www.pcbcart.com\/pcb-capability\/layer-stackup.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">But why would you ever want to use a multilayer PCB in the first place? Here are a few solid reasons:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">It\u2019s a well-known fact that a four-layer board will produce 15 dB less radiation than a two-layer board with all other variables being consistent. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">There\u2019s also the huge benefit of designing in a multi-board environment that can contain dedicated planes for ground, signal, power, etc.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Boards with multiple planes will also allow the routing of traces in either a microstrip or stripline configuration. These can help to carefully control impedance and emitted radiation better than a single-layer board even could.<\/span><\/li>\n<\/ul>\n\n\n\n<p>When you opt for a multi-layer PCB, you\u2019re also getting the benefits of multiple ground power planes, which can help to reduce impedance and ground noise in every design. Still not sure if you need a multi-layer PCB?<\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p><i><span style=\"font-weight: 400;\">Use our general rule of thumb &#8211; if your frequency range is going to be above 10 &#8211; 15 MHz, then multi-player boards will be needed to get the job done.<\/span><\/i><\/p>\n<\/blockquote>\n\n\n<h2 class=\"wp-block-heading\" id=\"planning-your-stackup\">Planning Your Stackup<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">When planning your layer stack, most designers just consider the amount of players they need, and little else. However, there are a lot more variables to consider when planning a robust set of layers, including:<\/span><\/p>\n\n\n\n<ol class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">How many layers your design requires<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">How much spacing you need between each layer<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">How the layers are going to be structured and organized<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">How many power\/ground planes your design requires<\/span><\/li>\n<\/ol>\n\n\n\n<p>When deciding how many layers your design requires, the details go even deeper with a new set of constraints to consider like:<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">The number of signals that need to be routed<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">The frequency of your signals<\/span><\/li>\n\n\n\n<li><a href=\"https:\/\/transition.fcc.gov\/Bureaus\/Engineering_Technology\/Documents\/bulletins\/oet62\/oet62rev.pdf\"><span style=\"font-weight: 400;\">The type of FCC emission requirements that your board has to meet, Class A or Class B<\/span><\/a><span style=\"font-weight: 400;\">.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">The type of enclosure your board will call home, whether that\u2019s shielded or unshielded.<\/span><\/li>\n<\/ul>\n\n\n\n<p>By considering not just one but all of these variables, you can go about determining how many layers your design will require. You can also use the table below to estimate the number of layers based on your board\u2019s pin density:<\/p>\n\n\n<?xml encoding=\"utf-8\" ?><figure class=\"wp-block-table MuiTableContainer-root\"><table class=\" MuiTable-root DhigTable--verticalAlignment--top\"><tbody><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><b>Pin Density (Pitch)<\/b><\/td><td class=\" MuiTableCell-root\"><b># of Signal Layers<\/b><\/td><td class=\" MuiTableCell-root\"><b># of Board Layers<\/b><\/td><\/tr><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">&gt; 1.0<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">2<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">2<\/span><\/td><\/tr><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">0.6 &#8211; 1.0<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">2<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">4<\/span><\/td><\/tr><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">0.4 &#8211; 0.6<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">4<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">6<\/span><\/td><\/tr><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">0.3 &#8211; 0.4<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">6<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">8<\/span><\/td><\/tr><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">0.2 &#8211; 0.3<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">8<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">12<\/span><\/td><\/tr><tr class=\" MuiTableRow-root\"><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">&lt; 0.2<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">10<\/span><\/td><td class=\" MuiTableCell-root\"><span style=\"font-weight: 400;\">14<\/span><\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<p>You can also use the equation below to figure out how many routing layers you\u2019ll need:<\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/CodeCogsEqn.gif\" alt=\"pcb-layer-equation\"\/><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">Here, <\/span><b>M <\/b><span style=\"font-weight: 400;\">is the number of routing layers you\u2019ll need in total, which is determined by the number of netlists, <\/span><b>N<\/b><span style=\"font-weight: 400;\">, multiplied by the average pitch, <\/span><b>Pavg<\/b><span style=\"font-weight: 400;\">, divided by the board length and board height, <\/span><b>lh<\/b><span style=\"font-weight: 400;\">. <\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"arranging-your-layers\">Arranging Your Layers<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">Once you&#8217;ve determined how many layers your design requires, you can then go about organizing them in a logical structure. When doing this, you\u2019ll want to consider both the distribution of your signal layers and also the distribution of your power\/ground layers. With these considerations in mind, here are some general principles to follow when arranging your layers:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">A signal layer always needs to be arranged adjacent to a ground plane. This will give the return signal an efficient path of travel from source to sink. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Your signal layer needs to be next to an internal power layer. This will provide shielding benefits from any emitted radiation. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">For high speed designs, designate a layer for these signals located between planes. These planes will act as a shield to minimize radiation. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Always place a ground layer between two adjacent signal layers. Doing this will lessen the chance of crosstalk affecting your signal transmissions. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Consider taking advantage of multiple ground planes if possible. This will lower the overall ground impedance of your board and reduce common-mode radiation. <\/span><\/li>\n<\/ul>\n\n\n\n<p>One thing to keep in mind when doing this process is that designers will often have to make a compromise when deciding between close signal\/plane coupling or close power plane\/ground plane coupling. Under normal PCB manufacturing methods, there\u2019s usually just not enough inter-plane capacitance between adjacent power and ground planes to provide ample decoupling below 500 MHz.<\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Because of this limitation, you\u2019ll likely want to op for tight coupling between your signal and return plane. Coupling between a signal layer and its return plane produces way more advantages in proper signal timing and reduced emissions than what you lose by not closely coupling your power planes. <\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"layer-stack-templates\">Layer Stack Templates<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">While your layer stack is uniquely yours, it can never hurt to follow an example template from your manufacturer. Listed below you\u2019ll find layer stack examples to help guide your planning process for four, six, and eight-layer boards.<\/span><\/p>\n\n\n<h3 class=\"wp-block-heading\" id=\"four-layer-stackup\">Four layer stackup<\/h3>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1327\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/Four_Layer_Stack_up.jpg\" alt=\"four-layer-stack\"\/><figcaption class=\"wp-element-caption\"><em>An example four-layer stack. (<a href=\"https:\/\/www.nexpcb.com\/blogs\/news\/17592137-pcb-stack-up-design\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">In this stack, we have high speed signals placed on the top layer with an efficient return path on Layer 2 (Ground Plane). The high speed signals on the bottom layer are referencing the power planes on Layer 3, and this will require placing stitching capacitors between the power plane and ground plane.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">In this stack, it\u2019s recommended to route your high speed signals on your top layer. That way the signals have a direct path to ground. But if your design calls for high speed signal routing on the bottom layer, you can simply swap Layers 2 and 3 to make that possible.<\/span><\/p>\n\n\n<h3 class=\"wp-block-heading\" id=\"six-layer-stackup\">Six layer stackup<\/h3>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1328\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/Six_Layer_Stack_up.jpg\" alt=\"six-layer-stack\"\/><figcaption class=\"wp-element-caption\"><em>An example six-layer stack. (<a href=\"https:\/\/www.nexpcb.com\/blogs\/news\/17592137-pcb-stack-up-design\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">In this stack high speed signals routed on the top layer have a reference plane on Layer 2. Stitching capacitors will be needed on this layer to reference the power plane to the ground plane.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Unlike the four-layer stock, this one is designed to have high speed signals routed on the bottom layer as it has an immediate reference to ground in Layer 5. Layers 3-4 is where you\u2019ll do all of your low speed signal routing, which has a reference plane on Layers 2 and 5.<\/span><\/p>\n\n\n<h3 class=\"wp-block-heading\" id=\"eight-layer-stackup\">Eight layer stackup<\/h3>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1329\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/Eight_Layer_Stack_up.jpg\" alt=\"eight-layer-stack\"\/><figcaption class=\"wp-element-caption\"><em>An example eight-layer stack. (<a href=\"https:\/\/www.nexpcb.com\/blogs\/news\/17592137-pcb-stack-up-design\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">In this stack, the high speed signals on the top layer are referenced with the Layer 2 ground plane. You\u2019ll also find Layer 3 using the same ground plane as its reference point. When using this stack and routing on Layer 3, you\u2019ll definitely need some stitching capacitors between the power and ground planes.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">You can also use Layer 6 when you need to route high speed signals with critical impedance control requirements. This layer will produce less EMI problems because it\u2019s shielded by two ground planes.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"documenting-your-layer-stackup\">Documenting Your Layer Stackup<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">Once you\u2019ve defined and arranged your layer stackup, the last thing you\u2019ll need to worry about is documentation for your fabricator. This is an important step, as one of the most common defects in the PCB fabrication process is the misordering of layers.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Aside from just generating Gerber files for each layer in your design, there are several strategies you can take to clearly document your stackup for manufacturing, including:<\/span><\/p>\n\n\n<h3 class=\"wp-block-heading\" id=\"adding-a-readme-file\">Adding a README file<\/h3>\n\n\n<p><span style=\"font-weight: 400;\">While your PCB software will output unique files for each layer in your PCB, how those layers fit together in a complete layer stack is up to you to communicate. To do this, simply submit a README file that details the orders of your layers and their associated files names to your manufacturer like in the example shown below:<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/download.png\" alt=\"eagle-layer-readme\"\/><\/figure>\n\n\n<h3 class=\"wp-block-heading\" id=\"numbering-layers-on-your-copper\">Numbering layers on your copper<\/h3>\n\n\n<p><span style=\"font-weight: 400;\">Within your design tool, we also recommend placing a layer number directly on each copper layer. This is a clear visual indicator for your fabricator that it\u2019s a layer number. When your PCB is viewed from its primary side profile, this numbering sequence will be shown for each layer on your board, making it easy to see layer numbers at a glance. To see this feature, you\u2019ll want to add a solder mask relief of 100 mils around each layer number. <\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/Fig-2-1-300x57.png\" alt=\"numbering-layers\"\/><\/figure>\n\n\n<h3 class=\"wp-block-heading\" id=\"adding-stacking-stripes-on-your-copper\">Adding stacking stripes on your copper<\/h3>\n\n\n<p><span style=\"font-weight: 400;\">While numbering your layers is useful, it doesn\u2019t fully communicate how your layer stack will be arranged in physical form. To address this concern, you can add what&#8217;s called a stacking stripe to the edge of each layer on your board.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">To do this, locate the primary side of your board and add a 200 mils x 50 mils box that protrudes off the side on your first layer. Then repeat this process on each subsequent layer, shifting the stripe over 200-250 mils for each layer.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/07\/pcb_stacking_stripes.png\" alt=\"pcb-stacking-stripes\"\/><\/figure>\n\n\n\n<p>By the time you\u2019re done, you\u2019ll have a set of stacking stripes that step down nicely and show how each layer is arranged in order. This will help to provide a quick visual inspection for QA, and will also give your fabricator an indication that they\u2019re assembling your layer stack right the first time.<\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"get-your-layer-stack-right\">Get Your Layer Stack Right<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">There\u2019s no reason to skimp on the process of carefully planning your layer stackup at the beginning of your design process. While many designers are just fine with defining their layer count and leaving the rest to their manufacturer, doing so leaves a lot to chance when considering future issues like radiation, crosstalk, and signal integrity. You know your design best, so doesn\u2019t it just makes sense to be in control of your layer stack? By carefully planning your layer stack right the first time, you\u2019ll be putting together the first line of defense to ensure that your board meets Electromagnetic Compatibility (EMC) requirements.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Ready to define a multilayer stack for your next electronics design? <a href=\"https:\/\/www.autodesk.com\/products\/eagle\/subscribe\">Subscribe to Autodesk EAGLE today!<\/a><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Don\u2019t think you need to take the time to plan your layer stackup? Think again. It\u2019s a lot more than just deciding how many layers you need. Learn how to get your layer stack right the first time, every time. <\/p>\n","protected":false},"author":2425,"featured_media":440,"menu_order":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"categories":[286,434],"tags":[],"coauthors":[],"class_list":["post-1321","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-eda","category-eagle","dhig-theme--light"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Getting Your Layer Stack Right the First Time | EAGLE | Blog<\/title>\n<meta name=\"description\" content=\"Learn how to properly plan a PCB layer stack for your electronics design to control heat, electromagnetic interference (EMI), and signal crosstalk.\" \/>\n<meta name=\"robots\" content=\"index, follow, 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