{"id":1147,"date":"2017-06-01T08:00:18","date_gmt":"2017-06-01T15:00:18","guid":{"rendered":"http:\/\/www.autodesk.com\/products\/eagle\/blog\/?p=1147"},"modified":"2023-09-25T14:25:30","modified_gmt":"2023-09-25T21:25:30","slug":"top-10-soldering-issues-can-ruin-pcb-design","status":"publish","type":"post","link":"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/top-10-soldering-issues-can-ruin-pcb-design\/","title":{"rendered":"Top 10 PCB Soldering Issues"},"content":{"rendered":"<h1 class=\"wp-block-heading\" id=\"the-top-10-soldering-issues-that-can-ruin-your-pcb-design\"><span style=\"font-weight: 400;\">The Top 10 Soldering Issues That Can Ruin Your PCB Design<\/span><\/h1>\n\n\n<p><span style=\"font-weight: 400;\">If you\u2019re making production level PCBs, then chances are you won&#8217;t be manually soldering components by hand. At this point, it\u2019s all about relying on your manufacturer to both fabricate your bare board and assemble all of your parts for you. While the soldering process with a manufacturer still relies on the same principles you used on your prototypes back in your lab, there\u2019s now some heavy-hitting machinery at play to get the job done. But just because there\u2019s machinery involved doesn\u2019t mean that this process is any less error prone than doing it by hand. Soldering at the manufacturing level is still very much a precise science that needs to be carefully controlled. Otherwise, you\u2019ll wind up with one of these 10 soldering issues.<\/span><\/p>\n\n\n<h2 class=\"wp-block-heading\" id=\"wave-soldering-101\">Wave Soldering 101<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">If this is your first PCB design that you\u2019re relying on a manufacturer to fabricate and assemble for you, then wave soldering might be a new term. This is the process of sending your PCB through a giant oven where all of your components get attached to your board in a matter of seconds. As you can imagine, this process is way more efficient than having to manually solder components by hand, and the machinery involved can handle both through-hole and surface mount components at the same time.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1149\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/wave-soldering.jpg\" alt=\"wave-solder-machine\"\/><figcaption class=\"wp-element-caption\"><em>A lead-free soldering machine on display, it\u2019s like a giant oven! (<a href=\"https:\/\/hbreflow.wordpress.com\/2014\/07\/28\/hisave-your-investment-on-lead-free-wave-soldering-machine-%EF%BC%81\/\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">The wave soldering process uses a wave soldering machine as shown in the image. This machine is a self-contained oven that takes a bare board with placed components on one end and provides a fully soldered board on the other end. In between this start and end point are several processes, including:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><b>Flux Application<\/b><span style=\"font-weight: 400;\">. Your board is first placed on a conveyor belt at the onset of the wave soldering machine, and a flux layer is applied. This layer cleans all of your components and ensures that solder can attach properly to the pins and pads on your components. <\/span><\/li>\n\n\n\n<li><b>Preheating<\/b><span style=\"font-weight: 400;\">. After passing through a flux application, your board then rests on a preheating pad. This process heats your board just enough to prevent any thermal shock before it heads into the soldering wave.<\/span><\/li>\n\n\n\n<li><b>Soldering Wave<\/b><span style=\"font-weight: 400;\">. This final stage is where your board passes over a liquid soldering wave. The bottom layer of your PCB will make contact with a liquid wave of solder, forming a connection between each component and their associated hole or pad.<\/span><\/li>\n<\/ul>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1150\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/ass_bapws_imga.gif\" alt=\"wave-soldering-process\"\/><figcaption class=\"wp-element-caption\"><em>The wave soldering process in visual form, from flux to solid wave. (<a href=\"http:\/\/www.mtarr.co.uk\/courses\/topics\/0225_wave\/#1\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">As you can see, this self-contained wave soldering process has many opportunities for mistakes from flux application to the final wave soldering process. We\u2019ll be exploring below how these processes can interact together with your physical circuit board to cause some unintended issues.<\/span><\/p>\n\n\n\n<blockquote class=\"wp-block-quote is-layout-flow wp-block-quote-is-layout-flow\">\n<p><b>Note:<\/b><span style=\"font-weight: 400;\"> If your board ends up having soldering issues, it\u2019s not always your fault. Yes, there are specific decisions that you need to make during your design process that will affect the manufacturability of your board, like component spacing, orientation, etc\u2026But outside of that, many issues arise during the wave soldering process because of problems on your manufacturer\u2019s end that need to be corrected.<\/span><\/p>\n<\/blockquote>\n\n\n\n<p><span style=\"font-weight: 400;\">Don\u2019t immediately place the blame on yourself if your board gets messed up due to soldering issues. The post-manufacturing analysis process will reveal the root cause, whether that\u2019s a defect in your design or a problem with your manufacturer\u2019s process or materials. When you or your manufacturer are looking for defects, it\u2019s always good to have an ideal image in your head of a healthy solder joint. Check it out below.<\/span><\/p>\n\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1151\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/tools_Solder_Joint.gif\" alt=\"perfect-solder-joint\"\/><figcaption class=\"wp-element-caption\"><em>A healthy solder joint with a smooth surface and 40-70 degree wetting angles. (<a href=\"https:\/\/learn.adafruit.com\/adafruit-guide-excellent-soldering\/common-problems\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n<h2 class=\"wp-block-heading\" id=\"1-solder-bridging\">#1 &#8211; Solder Bridging<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1152\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/SMDSoldering-9.jpg\" alt=\"solder-bridge\"\/><figcaption class=\"wp-element-caption\"><em>Check out the first two pins on this IC; they\u2019ve been connected forming a solder bridge. (<a href=\"https:\/\/www.sparkfun.com\/tutorials\/96\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">Solder bridging occurs when two solder joints connect, forming an unintended connection that can lead to short circuits on your board. As you can see in the image above, the first two pins on this IC have bridged together. Not good.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Some causes for solder bridging can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Designing a PCB with poor weight distribution with large components all on one side. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Not leaving enough space between your pads and your solder mask layer. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Not orientation components of the same type in the same direction.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"2-lifted-components-tombstone\">#2 &#8211; Lifted Components (Tombstone)<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1153\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/lifted_component1.gif\" alt=\"tombstone-components\"\/><figcaption class=\"wp-element-caption\"><em>A tombstone component that lifted up during wave soldering &#8211; RIP. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/lifted-component.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">Having a tombstone component on your board means that it raised off the base of your PCB during the wave soldering process. This ends up looking like a tombstone.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes for this type of issue can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Having an incorrect lead length that lifts when entering a solder bath.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Wave soldering a flexible PCB that bends while the components stay flat. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Using components that have varied thermal or lead solderability requirements.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"3-excessive-solder\">#3 &#8211; Excessive Solder<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1155\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/tools_Too_Much-1.jpg\" alt=\"excessive-solder\"\/><figcaption class=\"wp-element-caption\"><em>Excess solder buildup on this joint, notice the rounded shape. (<a href=\"https:\/\/learn.adafruit.com\/adafruit-guide-excellent-soldering\/common-problems\">Image source)<\/a><\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">If your board passes through a wave soldering machine and takes too much solder with it, you\u2019ll get an excess buildup. And while this excess solder might still be forming an electrical connection, it becomes hard to tell what\u2019s going on inside that rounded mass.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes of excessive solder can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Not orientation components of the same type in the same direction.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Using an incorrect lead length to pad ratio during your design process. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">On the manufacturer\u2019s end, the conveyor belt might also be running too fast.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"4-solder-balling\">#4 &#8211; Solder Balling<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1156\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/solder_ball2.gif\" alt=\"solder-balling\"\/><figcaption class=\"wp-element-caption\"><em>A solder ball is attaching itself to a component pin. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/solder-balls.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">Solder balling occurs when a small bit of soldier attaches itself to the surface of your PCB during the wave soldering process.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes of solder balling can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">The solder temperature being too high in the wave soldering machine.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Solder falling back into the solder wave during separation and splashing back onto your board. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">The gasses released when the flux is heated causing solder liquid to spit back up onto your board.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"5-solder-dewettingnonwetting\">#5 &#8211; Solder De-Wetting\/Non-Wetting<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1157\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/poor_wetting3.gif\" alt=\"poor-wetting\"\/><figcaption class=\"wp-element-caption\"><em>You can see the exposed copper here from solder non-wetting. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/poor-lead-solderability-and-wetting.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">When your solid is \u201cwet,\u201d this is a good thing. It means that your solder has reached an ideal fluid state and will be able to properly attach to a component lead or pad. There can be two issues with this wetting process. The first is de-wetting, where molten solder covers a lead or pad and then retreats, leaving behind an oddly shaped mound of solder. There\u2019s also non-wetting, where solder only partially attaches to a surface, leaving exposed copper behind.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes of both of these wetting issues can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">A manufacturer\u2019s component inventory not being properly rotated. Many parts only have a solderable shelf life of about a year.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">The flux being used by your manufacturer might be past its prime and needs to be changed after forty hours of use.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">The plating used on brass component pins might not have been properly plated with copper.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"6-lifted-pads\">#6 &#8211; Lifted Pads<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1158\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/lifted_pads1.gif\" alt=\"lifted-pads\"\/><figcaption class=\"wp-element-caption\"><em>This lifted pad might have just been overworked too much. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/lifted-pads.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">If a component is mistakenly soldered and needs to be removed, this can lead to the pad of said component lifting from your PCB.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes for a lifted pad can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Overworking the pad joint too much where the layer between the copper and your board is ruined. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Boards designed with thin layers of copper being more susceptible to this problem. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Your board might not have received an even layer of copper plating for through-hole component leads.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"7-pin-holes-amp-blow-holes\">#7 &#8211; Pin Holes &amp; Blow Holes<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1159\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/pinblow_hole1.gif\" alt=\"pin-hole\"\/><figcaption class=\"wp-element-caption\"><em>A blow hole was releasing some excess moisture buildup on a board. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/pin-blow-holes.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">Pin holes and blow holes are easy to identify, just look for the hole in a solder joint. This hole might extend all the way from the layer you\u2019re observing to internal layers, or even the bottom of your board, causing connectivity issues.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes for these holes can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Excess moisture building up in your board that will try to escape through thin copper plating.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Not orientating components of a similar type in the same direction, which can lead to a poor copper plating process.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">During your design process having a lead-to-hole ratio that is either too small or too large.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"8-solder-skips\">#8 &#8211; Solder Skips<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1160\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/solder_skip1.gif\" alt=\"solder-skips\"\/><figcaption class=\"wp-element-caption\"><em>The solder missed a spot on this SMD, a solder skip. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/solder-skips.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">As the name suggests, solder skips can occur when solder skips over a surface mount pad, leaving an unconnected area or pad.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes for solder skips can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Your manufacturer using an incorrect wave height between your board and soldering wave.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">The gassing of flux beneath your board causing the solder to not properly adhere to a joint.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">During your design process, placing down uneven pad sizes for an SMD component.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"9-solder-flags\"><span style=\"font-weight: 400;\">#9 &#8211; Solder Flags<\/span><\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1161\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/solder_flags1.gif\" alt=\"solder-flags\"\/><figcaption class=\"wp-element-caption\"><em>Solder flags standing at attention on a PCB. (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/solder-flags.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">While solder flags themselves will still leave the proper connection on your board, they are an indicator of poor flux application and solder drainage issues and may \u201cflag\u201d solder issues in other places on your board.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes for these protrusions from a solder joint can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">The solder draining slowly from a wave soldering machine, leading to an excessive height of solder. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">An inconsistent application of flux, which can be identified if you see whisker-like trails of solder on your board.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">If your component supplier cuts the leads on your parts and stores them for long periods of time, this can cause oxidation and solder will struggle to attach.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"10-solder-discoloration\">#10 &#8211; Solder Discoloration<\/h2>\n\n\n<figure class=\"wp-block-image aligncenter size-large size-full wp-image-1162\"><img decoding=\"async\" src=\"https:\/\/www.autodesk.com\/products\/fusion-360\/blog\/wp-content\/uploads\/eagle\/2017\/06\/discolor1.gif\" alt=\"solder-discolor\"\/><figcaption class=\"wp-element-caption\"><em>See the dark spots on this board? (<a href=\"http:\/\/www.epectec.com\/pcb\/wave-soldering-defects\/solder-mask-discoloration.html\">Image source<\/a>)<\/em><\/figcaption><\/figure>\n\n\n\n<p><span style=\"font-weight: 400;\">This last soldering issue is purely a cosmetic one, but your manufacturer should take the time to find out the root cause. Finding discolored mask can be identified on the solder resist, your PCB, and even the conveyor belt in the wave soldering machine.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Causes of solder mask can include:<\/span><\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li><span style=\"font-weight: 400;\">Your manufacturer using different flux materials or higher temperatures between wave soldering runs of the same board.<\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Your manufacturer changing the soldermask type or thickness halfway through a soldering cycle. <\/span><\/li>\n\n\n\n<li><span style=\"font-weight: 400;\">Your manufacturer mixing batches of circuit boards during the same wave soldering process.<\/span><\/li>\n<\/ul>\n\n\n<h2 class=\"wp-block-heading\" id=\"ride-the-wave\">Ride the Wave<\/h2>\n\n\n<p><span style=\"font-weight: 400;\">There you have it, the top 10 soldering issues that can ruin an otherwise great PCB design. Again, keep in mind that all of the issues we described above are not necessarily your fault if they occur. If you happen to be following a Design for Manufacturing (DFM) set of best practices, then the issue most likely falls on your manufacturer. Of course, all of these soldering issues should be identified by your manufacturer during the inspection phase. If a problem is found, it\u2019s then a process of finding the root cause, whether that\u2019s an issue with the wave soldering process or a problem with your design. To keep yourself ahead of the game and avoid soldering issues, always keep a DFM checklist on hand to make sure you\u2019re meeting your manufacturer\u2019s best practices. That way you can get a good board back right the first time, every time.<\/span><\/p>\n\n\n\n<p><span style=\"font-weight: 400;\">Ready to design and manufacture your first professional PCB? <\/span><a href=\"https:\/\/www.autodesk.com\/products\/eagle\/free-download\"><span style=\"font-weight: 400;\">Try Autodesk EAGLE for free today.<\/span><\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>You\u2019ve got 99 problems, and soldering might be one. Learn about the top 10 soldering issues that can ruin your PCB design. <\/p>\n","protected":false},"author":2425,"featured_media":1148,"menu_order":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"inline_featured_image":false,"footnotes":""},"categories":[286,434],"tags":[],"coauthors":[],"class_list":["post-1147","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-eda","category-eagle","dhig-theme--light"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.4 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Top 10 PCB Soldering Issues | EAGLE | Blog<\/title>\n<meta name=\"description\" content=\"Learn about the top 10 soldering issues that can ruin your PCB design including tombstone components, solder bridging, solder balling, and more.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, 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