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Amar Hanspal

Executive bios

Amar Hanspal

Senior Vice President and Chief Product Officer

As senior vice president and chief product officer, Amar Hanspal leads Autodesk’s transformation from a desktop-based solutions provider to a software as a service company.  He is responsible for the overall solution strategy and product execution for the company's core AEC and manufacturing markets and plays a key role in driving the company's business model transition to a subscription-based business.  In his role, Hanspal leverages several decades of experience driving growth through a combination of strategic insight, customer focus and operational excellence.  At Autodesk, Hanspal has served in a number of roles with increasing responsibility including vice president of Autodesk Collaboration Solutions, senior vice president of the Platform Solutions and Emerging Business (PSEB) Group and senior vice president of the Information Modeling and Platform Products (IPG) Group. He grew the company's BIM and AutoCAD businesses to over $1.5 Billion in revenue and initiated Autodesk's move to the cloud.  

Hanspal is a global leader: he has first-hand experience living and working in North America, Europe and Asia and has spearheaded Autodesk's investment in development centers in Shanghai, Singapore, Tel Aviv and Bucharest. He continues to drive operational excellence across the core product portfolio through product rationalization and key process initiatives while simultaneously strengthening the company's competitive advantage through key acquisitions.  He has driven growth through innovation and has led Autodesk’s investment in disruptive technologies such as additive manufacturing, and new market segments such as industrialized construction.

Prior to joining Autodesk, Hanspal was a project engineer on the Fermilab D-Zero Supercollider project. In his first tenure at Autodesk, from 1987 to 1999, Hanspal held various customer support and product management positions.  He then was the co-founder and vice president of marketing at RedSpark, an e-commerce and collaboration company focused on the manufacturing industry, prior to rejoining Autodesk in 2002. Mr. Hanspal holds a master’s of science in mechanical engineering from the State University of New York at Stony Brook and a bachelor’s degree in mechanical engineering from the University of Bombay.  He serves on the board of directors of eSilicon Corporation.